Scientific Topics

• Material aspects
  (defects, carrier lifetime, doping type, mobility, …)
• Advanced characterization and simulation
  (PL, EL, accurate measurement of back contact cells, carrier lifetime, simulation tools, quality assurance, inline measurements, …)
• Surface morphology and passivation
  (texture, dielectric passivation layers, diffused layers, optical performance, …)
• Junction formation
  (diffusion, amorphous hetero-junction, polysilicon, alloying, …)
• Structuring and contact formation
  (laser, inkjet, fine-line printing, plating, paste and ink development, …)
• Process integration
  (process sequences, production technology, process control, cost analysis, cell architecture, ...)
• Module integration
  (back-contact-cell modules, adhesive conductors, soldering, system aspects, reliability testing, …)